Diamond delivers the highest thermal conductivity of any bulk material — up to roughly 2,000 W/m·K in natural-carbon form, and higher when ¹²C-enriched. For devices pushing the limits of power density, this thermal performance is what unlocks the next generation. We supply monocrystalline diamond substrates to the customers building those devices.
Where diamond could fit
Diamond thermal substrates are increasingly explored where conventional materials — copper, AlN, SiC — can no longer extract heat fast enough. The application areas our customers and prospects work on include:
RF and microwave amplifiers. High-power GaN HEMTs and MMICs for radar, electronic warfare, and communications, where thermal extraction at the active layer determines achievable output power and reliability.
Satellite communications. Compact, high-data-rate radios where reduced size, weight, and power matter at orbital deployment cost.
High-power laser diodes and fiber laser pumps. Thermal management directly limits beam quality, output power, and lifetime in kilowatt-class systems.
High-density computing and AI accelerators. Hotspot management in advanced packaging where the thermal density of next-generation accelerators outpaces conventional cooling.
Cryogenic and quantum hardware. Thermal anchoring where every milliwatt of heat extraction matters.
These are markets being developed by our customers — they bring the device and integration expertise. Our role is to deliver high-quality diamond substrates that match their device flow.
What we offer
Form factor. Inch-scale diamond substrates today, with an active roadmap toward 2- and 4-inch formats. Bulk substrates of 100–500 μm thickness depending on integration requirements.
Thermal conductivity. Natural-carbon diamond substrates with thermal conductivity in the range of 2,000 W/m·K. ¹²C-enriched grades available where premium thermal performance is required.
Defect chemistry. Controlled impurity content, tuned to the application.
Surface preparation. Mechanical polishing to low surface roughness — a key parameter for the bonding interface quality and the thermal boundary resistance that ultimately limit device-level thermal performance.
Custom geometry. We work with customers on substrate specifications that go beyond standard configurations — dimensions, thickness, edge preparation, or specific surface requirements driven by your bonding or epitaxial flow. Co-development discussions welcome.
Integration
The device fabrication flow starts with our diamond substrate. From there, our customers carry out the steps required to integrate diamond into their device stack — typically direct wafer bonding (surface-activated, hydrophilic, or metallic bonding), or epitaxial growth of the active layer on diamond. We work alongside our customers from specification through delivery, adjusting substrate dimensions, thickness, surface finish, or impurity profile to match their flow — including iterating across prototype generations when needed.
Who this is for
Research institutes and companies developing GaN-on-diamond and other thermally-limited device technologies; high-power laser manufacturers; teams designing the next generation of compact, power-dense electronics.
Maturity
Diamond thermal substrates have moved from laboratory demonstration into pilot-scale evaluation and early industrial qualification. Sustained academic and defense investment over the past decade has established the technology base; the current frontier is volume scaling and substrate-size expansion.
Let's discuss your thermal challenge
If you are evaluating diamond for a high-power device, or designing a next-generation product where thermal margin will be the differentiator — we welcome a 30-minute call.
